Researchers at the Tokyo University of Science have developed a method to shape porous materials called metal–organic frameworks (MOFs) into microscopic patterns without destroying delicate structures.
Previously, carving these materials into tiny components for advanced electronics or chemical sensors required expensive liquid-nitrogen cooling to prevent them from collapsing under energy beams.
Liquid ionic filler soaks into the MOF’s microscopic pores, strengthening the structure so it can absorb heat and clear electrical charges during standard room-temperature etching.
This low-cost, scalable technique makes it much easier to incorporate over 100,000 known MOF variations into practical technologies like high-sensitivity sensors and micro-catalysts.
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