Anyone who has ever been frustrated by an overheating mobile phone or wondered how devices will withstand the heat generated by artificial intelligence (AI) applications may be excited to learn about a recent discovery that challenges long-standing assumptions about cooling pathways in electronics.
A multi-institution research team working at the Advanced Photon Source (APS), a U.S. Department of Energy (DOE) Office of Science user facility at DOE’s Argonne National Laboratory, has discovered a metallic material with the highest thermal conductivity measured among metals. Thermal conductivity describes how efficiently a material can carry heat. Materials with high thermal conductivity are essential for removing localized hotspots in electronic devices, where overheating limits performance.
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