What started as a fun experiment to create a decorative diamond “owl” for distinguished guests has evolved into a scalable manufacturing process for electronics.
Researchers at Rice University have developed a bottom-up method for growing patterned diamond surfaces to cool electronics.
The technique enables diamonds to be integrated directly into devices, reducing operating temperatures by 23°C (41°F).
It could help extend device lifespans, improve performance, and increase energy efficiency in technologies such as 5G, radar, and AI data centers.
“In the world of electronics, heat is the enemy,” said Xiang Zhang, assistant research professor of materials science and nanoengineering at Rice.
“A reduction of 23 C is significant — it can extend the lifespan of a device and allow it to run faster without overheating,” Zhang added.
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