Engineers have taken a major step toward producing the smallest earthquakes ever created, shrinking seismic-style vibrations down to the scale of a microchip.
The breakthrough centers on a device called a surface acoustic wave phonon laser. The technology could eventually enable more advanced chips for smartphones and other wireless electronics, helping make them smaller, faster, and more energy efficient.
The research was led by Matt Eichenfield, an incoming faculty member at the University of Colorado Boulder, along with scientists from the University of Arizona and Sandia National Laboratories. Their findings were published Jan. 14 in the journal Nature.
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